Microchip under precision probe needles during semiconductor testing

Precision VLSI Engineering

Silicon Excellence
Delivered at Scale.

Premium chip design services for the world's most demanding technology companies. From concept to tapeout, we engineer the future.

We are a specialized semiconductor design partner, delivering silicon-proven VLSI solutions across advanced process nodes for clients in power electronics, telecommunications, automotive, and IoT.

CORE SERVICES

Our Expertise.

Full-stack semiconductor design capability, mapped the way our engineers actually think about a chip.

// 01

3D-IC Design

Advanced 3D integration, chiplet architecture, die-to-die interfaces, and TSV design for next-gen packaging.

// 02

Silicon Photonics

Photonic IC design and integration services spanning waveguides, modulators, and electronic-photonic co-packaging for high-bandwidth optical interconnect.

// 03

RF & Analog

Transceivers, PLLs/synthesizers, and high-speed analog interfaces for 5G, Wi-Fi, automotive, and IoT applications.

// 05

TCAD Simulation

Process and device simulation, PDK calibration, and SPICE model extraction using Sentaurus TCAD and Silvaco Atlas/Victory.

// 04

Quantum Computing

Design and engineering support for quantum hardware — from cryo-CMOS control circuitry to qubit interconnect and packaging challenges unique to sub-Kelvin operation.

// 06

Physical Design

Full RTL-to-GDSII implementation — synthesis, floorplan, CTS, routing and signoff on nodes down to 3nm.

// 07

AMS Verification

Our modeling team delivers deep expertise in analog behavioral modeling and AMS (Analog Mixed-Signal) verification for complex analog IPs. We enable early mixed-signal validation, reducing verification cycles while improving design-to-silicon confidence.

UNDER THE FLOORPLAN

How each block actually gets built.

The toolchains, nodes, and signoff criteria behind each service area.

Device physics through to power stage.

We design high-electron-mobility transistors (HEMTs) across GaN-on-Si and GaN-on-SiC processes — from gate driver co-design to thermal reliability analysis. Every device is simulated end-to-end with SPICE models calibrated to foundry PDKs, targeting EV chargers, telecom, and 5G power stages.

  • HEMT design · GaN-on-Si & GaN-on-SiC
  • Process simulation via Sentaurus TCAD & Silvaco Atlas
  • I-V, C-V, transient & AC device analysis
  • SPICE extraction calibrated to foundry PDKs
Rendered HEMT die and gate driver package connected by ribbon leads

Advanced-node PnR, signed off.

Full RTL-to-GDSII implementation from synthesis through DRC/LVS signoff, across nodes from 3nm to 90nm using Synopsys Fusion Compiler, Cadence Innovus, and ICC2. Low-power flows with multi-Vt, power gating, and UPF/CPF — plus 3D-IC chiplet integration including UCIe, HBM, and EMIB die-to-die interfaces. 10+ tapeouts delivered.

  • RTL-to-GDSII · Synopsys FC · Cadence Innovus · ICC2
  • Nodes: 3nm, 5nm, 7nm, 14nm, 28nm → 90nm
  • Low-power: multi-Vt, power gating, UPF/CPF
  • Chiplet integration: UCIe · HBM · EMIB · TSV
Isometric floorplan tiles representing placed-and-routed standard cell blocks

RF-aware, parasitic-sensitive layout.

Proven expertise across LNAs, PAs, mixers, VCO/PLLs, and full transceiver front-ends — verified via HFSS and Momentum/ADS EM simulation. We cover HDMI, MIPI, USB3.x, and PCIe analog interfaces, SerDes AFE, LVDS/DDR/LPDDR comboPHY, and 5G communication chip IP modules, all built with parasitic-sensitive custom layout at the core.

  • LNA · PA · Mixer · VCO/PLL · Synthesizer design
  • Full TX/RX transceiver front-end architecture
  • SerDes AFE · LVDS/DDR/LPDDR comboPHY
  • EM simulation: HFSS & Momentum/ADS
RF die layout with concentric inductor rings and EM simulation overlay

ENGAGEMENT MODELS

Two ways to work with us.

Flexible delivery structures, built around how chip projects actually run.

// RETAINER-BASED

Dedicated team, monthly

Allocation

Senior engineers, assigned monthly

Scope

Task-driven — bugs, reviews, new features

Billing

Predictable monthly, easy to scale

Best for

Ongoing support & maintenance

// TURNKEY

Fixed scope, spec to silicon

Delivery

Complete spec → GDSII / silicon

Payments

Milestone-based — spec, RTL, tapeout

IP terms

Work-for-hire — client owns all IP

Best for

New products & time-critical tapeouts

IP SECURITY

Your IP never leaves the ODC.

Enterprise-grade protection at our Bangladesh offshore development center.

IP & Legal

  • NDA signed by all personnel
  • Work-for-hire — client owns IP
  • Export regulation adherence

Device & Data

  • Air-gapped RTL/Netlist/GDS machines
  • Full-disk encryption, EDR tools
  • No BYOD — company devices only

Access Control

  • Biometric ODC room access
  • MFA on all engineering systems
  • Role-based version control

Device & Data

  • Encrypted VPN to client servers
  • 24/7 ODC surveillance
  • Dedicated Bridge Engineer

FULL-STACK

One team, one partner

From TCAD device physics to physical verification signoff - no handoffs between vendors.

ADVANCED NODE

Proven on leading nodes

Tapeouts on TSMC 3nm–28nm, Samsung 5nm, and GlobalFoundries processes.

WHY BOSTON SEMICONDUCTOR

Built for chip teams that can't afford a leak.

IP-SAFE

Air-gapped delivery

Biometric ODC access and strict NDAs - your IP never leaves our secure environment.

COMMERCIAL

Flexible terms

Retainer or turnkey - we adapt to your project structure and budget.

TRACK RECORD

Silicon-validated

10+ tapeouts and proven analog IPs, recognized at BEAR 2025.

Blogs

Latest Insights.

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Understanding Semiconductor Device Modeling: The Foundation of Modern Chip Design

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LET'S BUILD TOGETHER

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